Hardware-rooted resilience for systems that must continue operating when communications, power, and trust collapse.

KELTUN develops substrate-level physical mechanisms that reduce electromagnetic coupling, enforce hardware isolation, and preserve controlled behaviour under stress.

Physical-layer continuity EM resilience mechanisms EU-aligned industrialisation
KELTUN chiplet substrate concept visual
Concept visual — representative only. Technical details are shared under NDA and within appropriate regulatory frameworks.

Key Benefits

Designed for environments where standard assumptions do not hold, and where continuity matters more than peak performance.

Physical-layer continuity

Core functions remain bounded and controlled under electromagnetic disturbance by enforcing resilience at the substrate and packaging level.

Hardware-enforced isolation

Isolation is triggered by measurable physical conditions rather than software decisions, reducing the risk of cascading failures across shared structures.

EU-ready scalability

The architecture is modular by design, enabling staged validation and manufacturing pathways aligned with European partners and supply chains.

Application Domains

These are integration targets, not product claims. KELTUN focuses on validated physical mechanisms first.

Defence communications

Resilient hardware nodes that preserve controlled behaviour when spectrum conditions degrade, links fail, or environments are contested.

Autonomous platforms

Substrate-level resilience building blocks suitable for integration into UAV/USV payload nodes and other unmanned systems.

Critical interfaces

Hardware-rooted mechanisms that support continuity at system boundaries where power, connectivity, and trust may degrade.

Disclosure discipline: Technical details are shared only with authorised partners under NDA and within appropriate regulatory frameworks.